Samsung DRAM Unveils Ultra-Thin LPDDR5X Technology

Samsung Launches Ultra-Thin LPDDR5X DRAM

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Samsung Electronics announced on August 6th that it has started mass production of the industry’s thinnest LPDDR5X DRAM.

The newly released 12GB and 16GB packages measure just 0.65mm in thickness, making them the thinnest LPDDR DRAMs of 12GB or greater currently available on the market. Samsung intends to solidify its leadership in the low-power DRAM market with this product.

This DRAM is built on a 12-nanometer class process with a four-layer stack structure, achieving approximately 9% reduction in thickness and a 21.2% improvement in thermal resistance compared to previous generations. This technological optimization results in lower heat generation, enabling high-performance applications like on-device AI to operate without degradation in performance.

A Samsung spokesperson explained that this product not only frees up space inside devices but also facilitates smoother airflow, effectively aiding in internal temperature control. Additionally, it minimizes performance limitations caused by heating in high-performance devices, significantly enhancing user experience.

Baek Yong-cheol, Vice President and Head of Product Planning at Samsung’s Memory Business, stated, “With the increasing demand for high-performance on-device AI, the performance of LPDDR DRAM and its ability to control temperature are becoming increasingly critical.” He added, “Samsung will continue to develop thinner low-power DRAMs and supply optimized solutions through close cooperation with our customers.”

The product is scheduled to be timely supplied to mobile application processors and mobile manufacturers, further expanding the low-power DRAM market.

Editor J-shine
_{Provided by: SAMSUNG}

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